- RONATEC NIS is a non-cyanide alkaline stripper that dissolves electroless nickel deposits from steel, copper and copper alloys.
- No Fe substrate attack
- No Brass or Copper substrate attack
- High stripping speed
- Cyanide Free Process
- Long-life-Up to 4 oz/gal (30 g/liter) Nickel Metal
ZINCATE 50 is a cyanide-free dilute zincate process for processing aluminum and its alloys. It removes aluminum oxide and applies a thin zinc film on the aluminum alloy by immersion to prevent its re-oxidation. This film can then be electroplated with copper, nickel and certain other electrolytic processes as well as with electroless nickel. The dilute ZINCATE 50 solution has low viscosity that rapidly penetrates the water film present on the cleaned aluminum. This new alloy process produces a denser, more uniform zinc film that improves adhesion to the aluminum, helping to insure excellent adhesion of the subsequent plate. This unique zincate film cannot be found with most other conventional zincates.
Ronatec RoHS EN 1012
The RoHS EN 1012 produces a high phosphorous electroless nickel deposit at elevated plating rates (0.40.6 mil per hour). This solution is ideal for critical high volume applications. Connector and Oil and Gas applications are common. The 1012 is also suitable for aerospace hardware.
RoHS EN 1012 deposits meet specification requirements of ASTM B733, AMS 2404, AMS-26074 (formerly Mil-C-26074), ISO 4527 and RoHS Directive 2002/95/EC.
Ronatec RoHS EN CSB
Ronatec RoHS EN CSB is a semi brite, medium phosphorous electroless nickel process developed to meet the requirements of the electrical connector industry. The deposit is more ductile than a standard, bright medium phosphorous process. This chemistry is suitable for extremely high build applications as well.
Ronatec RoHS EN 1000
EN 1000 is specifically formulated to produce a bright, medium phosphorous, electroless nickel deposit. The system is an excellent high speed production bath offering a 0.7 mil/hr or more rate of deposition over a wide range of solution loading for both rack or barrel applications. The resulting deposit is RoHS compliant and is in accordance with the requirements of REACH.
EN 1000 meets end use requirements of AMS 2404, Mil-C-26074, Mil-C-38999, and BAC 5728, DPS 9.67.
Enova Nistripr / Metex SCB / EN 86
Metex SCB (Enova Nistripr / Metex SCB / EN 86) Nickel Stripper is a two-component system designed to strip dull, semi-bright, bright or duplex nickel electrodeposits, or electroless nickel deposits from copper, brass, steel or assemblies of these materials. The solution will also strip nickel from steel with brazed joints.
The ENOVA 115 process is an electroless nickel-phosphorus plating system that incorporates polytetrafluoroethylene (PTFE) as occluded particles in a high phosphorus electroless nickel deposit matrix with a capability range from 15 to 25% by volume PTFE inclusion. This unique process is specially designed to produce a consistent amount of uniformly dispersed PTFE throughout the EN deposit and is a RoHS compliant coating. The ENOVA 115 PTFE Dispersion meets PFOS/PFOA free technology meets new regulation environmental demands.
The ENOVA 949 is specifically formulated to produce a semi-bright, high phosphorous electroless nickel deposit. It's an excellent high speed production bath offering a 0.5 mil/hr (12 microns/hr) rate of deposition over a wide range of solution loading for both rack or barrel applications. The process yields a deposit with excellent functional properties in terms of ductility, internal stress, solderability and corrosion resistance. It is recommended for applications requiring minimum deposit porosity for corrosive environments.
Enova 587 / 790 / 785
ENOVA EF 587 is a lead free, bright, medium phosphorus alloy system for processing ferrous and non-ferrous alloys. This process is created to have very good initiation rates for plating all types of substrates including steel, brass, copper and aluminum. It can provide over 5 MTO's solution life plating Aluminum substrates without the need for an additional costly EN strike chemistry. The resulting deposit provides a more consistent color and appearance with good deposit smoothness over a long solution life.ENOVA EF 587 is designed to deliver a high deposition rate with good throughput while providing exceptionally lasting stability during both bath make up and concentrate shelf life.